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International Concrete Abstracts Portal

Showing 1-5 of 13 Abstracts search results

Document: 

SP21-04

Date: 

January 1, 1968

Author(s):

R.J. Schutz

Publication:

Symposium Papers

Volume:

21

Abstract:

The history of epoxy-resin adhesives for bonding concrete and other materials to concrete is reviewed.

DOI:

10.14359/17541


Document: 

SP21-03

Date: 

January 1, 1968

Author(s):

W.R. McConnell

Publication:

Symposium Papers

Volume:

21

Abstract:

Widespread acceptance of epoxy surface treatments for pavements has been limited in part by problems associated with pinholding, poor surface appearance, and sheet detachment.

DOI:

10.14359/17540


Document: 

SP21-02

Date: 

January 1, 1968

Author(s):

H.A. Rooney

Publication:

Symposium Papers

Volume:

21

Abstract:

This article describes the work done by the Materials and Research Department of the California Divison of Highways, since 1954, in adapting epoxy resins to the maintenance and repair of concrete highways and bridge decks. It discusses how the high coefficient of thermal expansion of cured epoxy mortars, which causes portland-cement concrete over which the epoxy mortars are applied to rupture in tension, may be neutralized by the formulation of epoxy mortars having high creep values at sub-zero temperatures. The first use of adhesives of the epoxy-resin type to bond new portland-cement concrete to old portland-cement concrete was made by the Materials and Research Department in 1954 and is described in this article.

DOI:

10.14359/17539


Document: 

SP21-01

Date: 

January 1, 1968

Author(s):

G.M. Scales

Publication:

Symposium Papers

Volume:

21

Abstract:

The name, origin, history, and development of epoxy resins over the last 20 years are described.

DOI:

10.14359/17538


Document: 

SP21-12

Date: 

January 1, 1968

Author(s):

G.N. Harding and B.U. Duvall

Publication:

Symposium Papers

Volume:

21

Abstract:

This paper discusses items pertinent to various epoxy-resin systems applications and suggests features that should be incorporated in application specifications.

DOI:

10.14359/17549


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